Influence of non-metallic parts of waste printed circuit boards on the properties of plasticised polyvinyl chloride recycled from the waste wire

Author:

Das Rajesha K1,Gohatre Omdeo K1,Biswal Manoranjan1,Mohanty Smita1,Nayak SK1

Affiliation:

1. Laboratory for advanced research in polymeric materials, CIPET, Bhubaneswar, India

Abstract

Extreme complexity in the range of metallic and non-metallic parts present in waste printed circuit boards leads to incineration for collecting valuable metals. The non-metallic parts of the printed circuit board can be used effectively without affecting the environment. In this study, the non-metallic parts of the printed circuit board, which is made up by cross-linked resin and fibre, was used as a filler in recycled plasticised polyvinyl chloride collected from waste wires and cables. The properties of the plasticised polyvinyl chloride matrix and plasticised polyvinyl chloride–non-metallic parts of printed circuit board composite were compared with each other by means of mechanical properties and thermal properties. Both mechanical and thermal properties results indicated that incorporation of non-metallic parts of printed circuit board significantly improved the hardness, stiffness, abrasion resistance and thermal stability of plasticised polyvinyl chloride–non-metallic parts of printed circuit board composite; however, the tensile strength of the composite material is not improved because of poor adhesion between the plasticised polyvinyl chloride matrix and non-metallic parts of printed circuit board filler. The poor chemical interaction is also observed from Fourier transform infrared spectroscopy results. This plasticised polyvinyl chloride–non-metallic parts of printed circuit board composite can reduce the leaching of a hazardous element from the printed circuit board with effective utilisation of plastics fraction from waste wires and cables.

Funder

Department of Science and Technology, Ministry of Science and Technology

Publisher

SAGE Publications

Subject

Pollution,Environmental Engineering

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