A two-dimensional micromechanical damage–healing model on microcrack-induced damage for microcapsule-enabled self-healing cementitious composites under compressive loading

Author:

Zhu Hehua123,Zhou Shuai234,Yan Zhiguo123,Ju J Woody24,Chen Qing5

Affiliation:

1. State Key Laboratory for Disaster Reduction in Civil Engineering, Tongji University, Shanghai, China

2. Department of Geotechnical Engineering, Tongji University, Shanghai, China

3. Key Laboratory of Geotechnical and Underground Engineering of the Ministry of Education, Tongji University, Shanghai, China

4. Department of Civil and Environmental Engineering, University of California, Los Angeles, USA

5. Key Laboratory of Advanced Civil Engineering Materials of the Ministry of Education, Tongji University, Shanghai, China

Abstract

The use of microcapsule-enabled self-healing cementitious composite has high potential as a new repair method for the cracked concrete. It will evidently provide extended lifetime and security while reducing the maintenance costs and rates of occurrences of system failures by incorporating self-healing agents in microcapsules. Based on experimental observation and Taylor’s model, a two-dimensional micromechanical damage–healing model of microcapsule-enabled self-healing cementitious materials under compressive loading has been proposed. The proposed model can predict the healing effect on microcrack-induced damage quantitatively under compressive loading. The kinetic equations of damage–healing evolution and the formulations of compliance after healing are developed. Subsequently, the proposed model is validated by experimental data. Different system parameters of microcapsule-enabled self-healing concretes, such as the fracture toughness of healing agents, the degree of initial damage, the volume fraction and radius of microcapsules, are investigated. In particular, the proposed micromechanical damage–healing model demonstrates the potential capability to explain and simulate the physical behavior of microcapsule-enabled self-healing materials under compressive loading on the mesoscale.

Publisher

SAGE Publications

Subject

Mechanical Engineering,Mechanics of Materials,General Materials Science,Computational Mechanics

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