Preparation and thermal properties of epoxy composites filled with negative thermal expansion nanoparticles modified by a plasma treatment-Reference-Cited by-同舟云学术

Preparation and thermal properties of epoxy composites filled with negative thermal expansion nanoparticles modified by a plasma treatment

Published:2010-10-27 Issue:16 Volume:45 Page:1675-1682
ISSN:0021-9983
Container-title:Journal of Composite Materials
language:en
Short-container-title:Journal of Composite Materials

Author:

Rongjin Huang ¹,Zhen Chen ²,Xinxin Chu ²,Zhixiong Wu ²,Laifeng Li ³

Affiliation:

1. Key Laboratory of Cryogenics, Technical Institute of Physics and Chemistry, Chinese Academy of Sciences, Beijing 100190, P.R. China

2. Key Laboratory of Cryogenics, Technical Institute of Physics and Chemistry, Chinese Academy of Sciences, Beijing 100190, P.R. China, Graduate University of the Chinese Academy of Sciences, Beijing 100080, P.R. China

3. Key Laboratory of Cryogenics, Technical Institute of Physics and Chemistry, Chinese Academy of Sciences, Beijing 100190, P.R. China,

Abstract

Epoxy composites filled with negative thermal expansion nanoparticles, Mn3(Cu0.6Si 0.15Ge0.25)N, modified by a plasma treatment were prepared. Thermal expansion properties and thermal conductivities of the Mn3(Cu 0.6Si0.15Ge0.25)N/ epoxy composites were investigated within the temperature range of 77—300 K. Compared to neat epoxy resin, Mn3(Cu0.6Si0.15Ge0.25)N/epoxy composites show remarkably lower coefficient of thermal expansions (CTEs) and higher thermal conductivities. Especially for the composite with 32 vol.% of Mn3(Cu0.6Si0.15Ge0.25)N, the reduction of CTE value up to 42% in the temperature range of 77—195 K, and the thermal conductivities are 2.8 and 4 times as large as those of the neat epoxy resin at 298 and 77 K, respectively.

Publisher

SAGE Publications

Subject

Materials Chemistry,Mechanical Engineering,Mechanics of Materials,Ceramics and Composites

Link

http://journals.sagepub.com/doi/pdf/10.1177/0021998310385031

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