Realization of electromagnetic shielding performance for polyimide-matrix composite by self-metallization-Reference-Cited by-同舟云学术

Realization of electromagnetic shielding performance for polyimide-matrix composite by self-metallization

Published:2021-07-08 Issue:26 Volume:55 Page:3849-3860
ISSN:0021-9983
Container-title:Journal of Composite Materials
language:en
Short-container-title:Journal of Composite Materials

Author:

Zhang Jiayang¹²^ORCID,Ni Hongjiang¹²^ORCID,Gong Ming¹²,Li Jun¹²,Zhang Daijun¹²,Chen Xiangbao¹²

Affiliation:

1. Research Center of Soft Materials Technology, Aero Engine Corporation of China, Beijing Institute of Aeronautical Materials, China

2. National Key Laboratory of Advanced Composites, Aero Engine Corporation of China, Beijing Institute of Aeronautical Materials, China

Abstract

Electromagnetic shielding performance has been achieved for a polyimide (PI)-matrix composite by the strategy of self-metallization of its thermosetting PI matrix. Self-metallization of the thermosetting PI was realized by silver ion/poly(amic acid) (PAA) precursor ion exchange and thermal reduction. The factors influencing the self-metallization were investigated. The electrical conductivity and integrity for the surface of the PI were achieved by optimization of ion exchange/thermal reduction parameters. The fabricated PI-matrix composite exhibits a maximum electromagnetic interference shielding effectiveness value of 81 dB. Importantly, the electromagnetic shielding performance can be maintained even after heat condition of 300°C. Meanwhile, the surface-metallized PI composite exhibits mechanical property equivalent to the pristine composite, and an Ag/matrix interfacial strength higher than 19.6 MPa. Besides, self-metallization mechanism of the thermosetting PI was investigated.

Publisher

SAGE Publications

Subject

Materials Chemistry,Mechanical Engineering,Mechanics of Materials,Ceramics and Composites

Link

http://journals.sagepub.com/doi/pdf/10.1177/00219983211031664

Reference35 articles.

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