Theoretical and Experimental Study on Die Pressure Prediction in Extrusion of Wood-Plastic Composite

Author:

Behravesh A.H.1,Shakouri E.2,Zolfaghari A.2,Golzar M.2

Affiliation:

1. Mechanical Engineering Department, Tarbiat Modares University P.O. Box 14115-143, Tehran, Iran,

2. Mechanical Engineering Department, Tarbiat Modares University P.O. Box 14115-143, Tehran, Iran

Abstract

This article presents a theoretical and experimental study on the measurement and prediction of die pressure in the extrusion process of wood-plastic composite (WPC). Die pressure is an important parameter in processing of WPCs as it governs the product strength, quality, and the final output rate, which directly affects the economy of the production. In this research work, a modular die was designed to accommodate for various circular die inserts to produce rod-shaped products having various diameters. Experimentation was carried out to record the pressure for each product. To develop a theoretical formulation for die pressure, two different schemes were considered and modified: non-Newtonian flow and hot extrusion. The comparison of the experimental and theoretical results demonstrated that the experimental values are between the values predicted by the two theoretical schemes. However, it was shown that by applying a correction factor (based on the compaction ratio of die) into the hot extrusion scheme, a theoretical ground can be suggested for pressure prediction in WPC processing. It appeared that the WPC flow in the die resembles more of a plug flow.

Publisher

SAGE Publications

Subject

Materials Chemistry,Mechanical Engineering,Mechanics of Materials,Ceramics and Composites

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号  京ICP备18003416号-3