Polyimide fabric-reinforced polyimide matrix composites with excellent thermal, mechanical, and dielectric properties

Abstract

Two types of thermosetting polyimide (PI) resin were prepared using a polymerization monomeric reactant method, and high performance PI fabric/PI resin composites were fabricated through a wet infiltration and thermoforming process. The properties of a PI fabric, PI resin, and PI/PI composites were comprehensively analyzed. The experimental results indicate that a resin end-capped with phenylacetylene achieves a better processability and heat resistance. The two composites exhibit excellent thermal, mechanical, and dielectric properties. They achieve a glass transition temperature of higher than 320°C and a 5% weight loss temperature of over 600°C under an air atmosphere. During mechanical testing, an interlaminar shear strength exceeding 35 MPa was achieved, whereas the maximum flexural strength was found to be greater than 400 MPa. Moreover, their dielectric constant at 1 MHz was below 3.4, with a dielectric loss of no more than 0.01.