Preparation and Properties of Glass Cloth-reinforced Meltable Thermoplastic Polyimide Composites for Microelectronic Packaging Substrates

Abstract

Meltable thermoplastic polyimide resins (MTPI) with designed polymer backbones and controlled molecular weights for advanced microelectronic packaging substrate application have been synthesized by thermal polycondensation of aromatic dianhydride and aromatic diamine in presence of endcapping agent. The thermoplastic polyimide resins could be dissolved in organic solvents to give low viscosity solutions, which were then employed to impregnate E-glass cloth (EG) to yield MTPI/EG prepregs. After removal of the organic volatile, the MTPI/EG prepregs were plied up and then melt processed to give MTPI/EG composite laminates with high quality. Experimental results demonstrated that the MTPI/EG composite laminates showed desirable characteristics, including: (1) excellent thermal stability; (2) good mechanical properties; (3) great electrical insulating and dielectric properties; as well as (4) high peel strength between copper foil and the composite surface.