Fabrication and characterization of ceramic-filled thermoplastics composites with enhanced multifunctional properties
Author:
Affiliation:
1. Department of Mechanical and Industrial Engineering, University of Toronto, Toronto, ON, Canada
2. Department of Electrical and Computer Engineering, University of Toronto, Toronto, ON, Canada
3. AEG Power Solutions Inc., Markham, ON, Canada
Abstract
Publisher
SAGE Publications
Subject
Condensed Matter Physics,Ceramics and Composites
Link
http://journals.sagepub.com/doi/pdf/10.1177/0892705712452746
Reference41 articles.
1. Preparation of SiCp/A356 electronic packaging materials and its thixo-forging
2. Thermal, dielectric, and mechanical properties of SiC particles filled linear low-density polyethylene composites
3. Thermal Management for Boron Nitride Filled Metal Core Printed Circuit Board
4. Enhanced thermal conductivity of polymer composites filled with hybrid filler
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