Author:
Lee Geon-Woong,Park Min,Kim Junkyung,Lee Jae Ik,Yoon Ho Gyu
Subject
Mechanics of Materials,Ceramics and Composites
Reference20 articles.
1. Procter P, Solc J. Improved thermal conductivity in microelectronic encapsulants. Dexter's technical paper 1999;February:1–8.
2. Plastic encapsulated microelectronics;Pecht,1995
3. Thermal conductivity of molding compounds for plastic packaging;Bujard;IEEE Trans Compon Hybrids Manuf Technol Part A,1994
4. Improved thermal conductivity in microelectronic encapsulants;Procter;IEEE Trans Compon Hybrids Manuf Technol,1991
5. Very high thermal conductivity obtained by boron nitride-filled polybenzoxazine;Ishida;Thermochim Acta,1998
Cited by
678 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献