Test Results of Resonant Integrated Microbeam Sensor (RIMS) for Acoustic Emission Monitoring

Abstract

The feasibility of detecting stress-wave acoustic phenomena with Honeywell's resonant microbeam-based MEMS sensor technology is presented. The baseline technical approach described here incorporates an integrated silicon microstructure and a resonant microbeam with micron-level feature size, and features frequency sensitivity up to 500 kHz. The stress-wave acoustic MEMS concept has been demonstrated successfully in the laboratory test environment to sense simulated acoustic emission (AE) events for structural fatigue crack monitoring applications. The technical design approach and laboratory test results are presented.