Modeling the curing behavior of a toughened hot curing epoxide adhesive during the paint drying process

Abstract

Lightweight body-in-white is often based on a mix of materials that causes problems in the production process. More specifically, the paint oven process after cathodic dip-coating can lead to damaged adhesive layers due to mismatches in thermal expansion of the materials. The understanding of the curing behavior of the structural adhesive cured in this oven process is of crucial interest to determine the damaging in numerical analyses. Therefore, the curing behavior of a one-component toughened hot curing structural adhesive is modeled using three model-based and a model-free approach as well as experimental data from differential scanning calorimetry. After the parameter identification of the models, the parameters are validated using an oven-process-like temperature profile to compare experimental and numerical data.