Compressive performance of paper honeycomb core layer with double-hole in cell walls

Author:

Guo Yanfeng1,Sun Yuxi1,Fu Yungang1,Liu Jiaxue1,Wang Huineng1ORCID,Yu Niuniu1ORCID

Affiliation:

1. Department of Packaging Engineering, Xi’an University of Technology, Xi’an, Shaanxi Province, P.R. China

Abstract

The perforated paper honeycomb structure with double-hole in cell walls is one kind of innovative sandwich structure also to improve drying process of traditional honeycomb paperboard. Based on the analytical calculation, experiment inspection and finite element analysis, this paper is focus on the paper honeycomb core layer with double-hole in cell walls, and especially studies the bending and folding deformation and the compressive strength under out-of-plane quasi-static compression for different humidity. The structure first appears elastic buckling and folds near the circular holes in the cell wall, and goes on buckling, folding and crushing until to the densification with the continuously increase of compression set. Its quasi-static compressive stress and strain curve mainly shows four kinds of compression deformation processes, such as linear elastic stage, elastic yielding stage, plastic collapse stage, and densification stage. The critical stress and plateau stress of the structure slowly decrease with the increase of humidity and aperture, and the multiple linear regression analysis result illustrates that the relative humidity has much more influence on the critical stress and plateau stress. For different humidity and aperture, the analytical calculation result is close to the experiment result. However, the finite element simulation result greatly deviates from the above two results, especially for relative humidity 50% and 60% cases.

Funder

Foundation of Xi'an Science and Technology Bureau

Foundation of Shaanxi Province Science and Technology Department

National Natural Science Foundation of China

Publisher

SAGE Publications

Subject

Applied Mathematics,Mechanical Engineering,Mechanics of Materials,Modeling and Simulation

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