"THERMOELASTIC DISPLACEMENT DUE TO TRANSIENT SURFACE HEATING "

Author:

Cerlinca Delia, ,Spinu Sergiu,

Abstract

The starting point in the calculation of normal displacement due to transient heating is the Green’s function for the elastic half-space. Superposition principle leads to a triple integral (double integral over surface and simple integral over time) that can be formally re-written as a three-dimensional convolution product. Given the singularities of the Green’s function in the time/space domain, it is more convenient to employ its spectral counterpart, i.e. the frequency response function (FRF), in the convolution calculation. A special technique for the calculation of the 3D convolution product based on the FRF is advanced in this paper. The resulting algorithm is very efficient from a computational point of view, as the transfers to and from the time/space domain to the frequency domain are handled by the fast Fourier transform. A simulation example is presented, involving the transient thermoelastic displacement due to a uniform heat source that vanishes everywhere except for a square surface domain, and which is applied continuously only in a limited time window. The numerical results predict that the displacement increases with time as long as heat is supplied, and is gradually recovered once the heat is removed. The loaded half-space patch undergoes a growth-release process that is accurately captured by the simulation method. The developed framework anticipates the solution of the contact process with transient heating.

Publisher

Asociatia Profesionala in Tehnologii Moderne de Fabricatie

Subject

Industrial and Manufacturing Engineering

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号  京ICP备18003416号-3