Air Cavity Incorporation to LTCC Spiral Inductor for High Q-factor and SRF-Reference-Cited by-同舟云学术

Air Cavity Incorporation to LTCC Spiral Inductor for High Q-factor and SRF

Published:2004-01 Issue:6 Volume:58 Page:434-436
ISSN:1434-8411
Container-title:AEU - International Journal of Electronics and Communications
language:en
Short-container-title:AEU - International Journal of Electronics and Communications

Author:

Eun Ki Chan,Park Chul Soon

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering

Reference4 articles.

1. Development of Three Dimensional Ceramic-Based MCM Inductors for Hybrid RF/Microwave Applications;Sutono;IEEE RFIC Symposium,1999

2. Buried Passive Elements Manufactured in LTCC;Rytivaara;Packaging and Interconnects at Microwave and mm- Wave Frequencies. (Ref. No. 2000/083) IEE Seminar,2000

3. High Q LTCC-Based Passive Library for Wireless System-on- Package (SOP) Module Development;Sutono;IEEE Transactions on Microwave Theory and Techniques, Vol.,2001

4. Fully Embedded LTCC Spiral Inductors for L-Band RF System-in- Package (SIP) Applications;Eun;IEICE Transaction on Electronics,2003

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4. Benefits of the LTCC Substrate Configuration with an Air-Gap for Realization of RF Inductor with High Q-Factor and SRF;International Journal of Applied Ceramic Technology;2012-01

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