Multi-level Electro-Thermal Simulation of Power PCB Electronic Modules for Motor Driving-Reference-Cited by-同舟云学术

Multi-level Electro-Thermal Simulation of Power PCB Electronic Modules for Motor Driving

Published:2023-12-12 Issue: Volume:22 Page:126-134
ISSN:2224-266X
Container-title:WSEAS TRANSACTIONS ON CIRCUITS AND SYSTEMS
language:en
Short-container-title:

Author:

Petrosyants Konstantin O.¹,Kharitonov Igor A.¹,Tegin Mikhail S.¹

Affiliation:

1. National Research University “Higher School of Economics”, Moscow Institute of Electronics and Mathematics, Tallinskaya ul., 34, Moscow, 123458, RUSSIA

Abstract

A scheme of automated multi-level electro-thermal modeling of power PCB modules using software tools Comsol at the device construction level, SPICE tool at the circuit level, and Asonika-TM tool at board level was proposed to improve the conventional design approach. The effectiveness of the proposed methodology is demonstrated in the example of electro-thermal analysis of real power MOSFET driver circuit realized on PCB.

Publisher

World Scientific and Engineering Academy and Society (WSEAS)

Subject

Electrical and Electronic Engineering

Reference24 articles.

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