Author:
Kao C. T.,Kuo An-Yu,Dai Yun
Cited by
2 articles.
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1. Multi-level Electro-Thermal Simulation of Power PCB Electronic Modules for Motor Driving;WSEAS TRANSACTIONS ON CIRCUITS AND SYSTEMS;2023-12-12
2. PCB-Level Thermal & SI/PI Co-Analysis: Progress and Directions;2022 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC);2022-09-01