Thermophysical Characterization of Composite Clay Materials Doped by the Copper Powder According to the Temperature

Abstract

The objective of this work is the development of a composite material of clay doped with copper powder and with thermal properties likely to give it a great importance in the ceramic industry, has been the subject of increased attention in recent decades because of their multiple uses as thermal insulators in the fields of ceramics and heterogeneous catalysis. Indeed, this study is based on a global approach of the properties of the material, accompanied by a thorough analysis of the thermophysical characteristics. The thermal conductivity of this material was determined as a function of copper content and temperature. Experiments have shown that thermal conductivity increases with the copper content and decreases with temperature, the experience made by an apparatus called CT-METRE. A theoretical model of the composite material allowing to approach more finely the heat transfers and also to validate the experimental results obtained