Elasto Hydrodynamic Lubrication Analysis of CMP Process with Consideration of Micro Asperity Contact of Polishing Pad

Author:

HASHIMOTO Yohei,SUZUKI Norikazu,ASABA Masakazu,HINO Rei,SHAMOTO Eiji

Publisher

Japan Society for Precision Engineering

Subject

Mechanical Engineering

Reference20 articles.

1. 1) International Technology Roadmap for Semiconductors 2009 Edition, Interconnect, (2009), 32, http://www.itrs.net/Links/2009ITRS/Home2009.htm

2. 3) J. Tichy, J. A. Levert, L. Shan and S. Danyluk : Contact Mechanics and Lubrication Hydrodynamics of Chemical Mechanical Polishing, J. of Electrochemical Society, 146, 4 (1999) 1523.

3. 4) Wlon J. Terrell and C. Fred Higgs III : Hydrodynamics of Slurry Flow in Chemical Mechanical Polishing, J. of Electrochemical Society, 153, 6 (2006) K15.

4. 5) D. Castillo-Mejia, J. Kelchner, S. Beaudoin : Polishing Pad Surface Morphology and Chemical Mechanical Planarization, J. of Electrochemical Society, 151, 4 (2004) G271.

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