Proposal of Intelligent Polishing System by Artificial Intelligence Using Neural Networks-Reference-Cited by-同舟云学术

Proposal of Intelligent Polishing System by Artificial Intelligence Using Neural Networks

Published:2020-01-05 Issue:1 Volume:86 Page:80-86
ISSN:0912-0289
Container-title:Journal of the Japan Society for Precision Engineering
language:en
Short-container-title:Journal of the Japan Society for Precision Engineering

Author:

YOSHISAKI Daichi,UNEDA Michio,SHIBUYA Kazutaka,MIYASHITA Tadakazu,ISHKAWA Ken-ichi

Publisher

Japan Society for Precision Engineering

Subject

Mechanical Engineering

Link

https://www.jstage.jst.go.jp/article/jjspe/86/1/86_80/_pdf

Reference6 articles.

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2. 5) A.T.Budnikou, E.A.Vovk, S.I.Krivonogou, A.Ya.Danko, O.A.Lukiyenko: Anisotropy of sapphire properties associated with chemical - mechanical polishing with silica, Functional Materials, 17, 4 (2010) 488.

3. 6) JieWang, Tongqing, Wang, Guoshun Pan, and Xinchun Lu: Mechanism of GaN CMP Based on H₂O₂ Slurry Combined with UV Light, ECS Journal of Solid State Science and Technology, 4, 3 (2015) 112.

4. 12) Michio UNEDA, Yuki MAEDA, Kazutaka SHIBUYA, Yoshio NAKAMURA, Daizo ICHIKAWA, Kiyomi FUJII and Ken-ichi ISHIKAWA: Influence of Pad Surface Asperity on Removal Rate in Chemical Mechanical Polishing of Large-Diameter Silicon Wafer Applied to Substrate of GaN-Based LEDs, Sensors and Materials, 26, 6 (2014) 435.

5. 21) Akira Isobe, Msatoshi Akaji, Shuhei Kurokawa: Proposal of New Polishing Mechanism Based on Feret's Diameter of Contact Area between Polishing Pad and Wafer, Japanese Journal of Applied Physics, 52 (2013) 12503 1.

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