Enhancement of thermal contact conductance of coated junctions

Author:

Chung Kee-Chiang1,Sheffield John W.2

Affiliation:

1. National Yunlin Institute of Technology, Yunlin 640, Taiwan, Republic of China

2. University of Missouri-Rolla, Rolla, Missouri 65401

Publisher

American Institute of Aeronautics and Astronautics (AIAA)

Subject

Condensed Matter Physics,Aerospace Engineering,Space and Planetary Science,Fluid Flow and Transfer Processes,Mechanical Engineering

Cited by 4 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Measurement and Prediction of Thermal Contact Resistance Across Coated Joints;Experimental Heat Transfer;2011-03-14

2. An experimental investigation of thermal contact conductance across bolted joints;Experimental Thermal and Fluid Science;2001-12

3. Heat transfer—a review of 1995 literature;International Journal of Heat and Mass Transfer;1999-08

4. Review of Heat Transfer Technologies in Electronic Equipment;Journal of Electronic Packaging;1995-12-01

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