Heat transfer—a review of 1995 literature-Reference-Cited by-同舟云学术

Heat transfer—a review of 1995 literature

Published:1999-08 Issue:15 Volume:42 Page:2717-2797
ISSN:0017-9310
Container-title:International Journal of Heat and Mass Transfer
language:en
Short-container-title:International Journal of Heat and Mass Transfer

Author:

Eckert E.r.g,Goldstein R.J,Ibele W.e,Patankar S.V,Simon T.W,Strykowski P.J,Tamma K.K,Kuehn T.H,Bar-Cohen A,Heberlein J.V.R,Davidson J.H,Bischof J,Kulacki F,Kortshagen U

Publisher

Elsevier BV

Subject

Fluid Flow and Transfer Processes,Mechanical Engineering,Condensed Matter Physics

Reference1675 articles.

1. D.G. Blanchard, L.S. Fletcher, Contact conductance of selected metal–matrix composites, Journal of Thermophysics and Heat Transfer 9 (3) (1995) 391.

2. K.-C. Chung, Effect of surface deformations on thermal contact conductance of coated junctions, Journal of Thermophysics and Heat Transfer 9 (4) (1995) 681.

3. K.-C. Chung, J.W. Sheffield, Enhancement of thermal contact conductance of coated junctions, Journal of Thermophysics and Heat Transfer 9 (2) (1995) 329.

4. K-C. Chung, H.K. Benson, J.W. Sheffield, Thermal contact conductance of ceramic substrate junctions, Journal of Heat Transfer—Transactions of the ASME 117 (2) (1995) 508.

5. A.H. Howard, J.M. Ochterbeck, G.P. Peterson, Effects of metallic vapor deposition process and the overall coating thickness on thermal contact conductance, Journal of Heat Transfer—Transactions of the ASME 117 (4) (1995) 828.

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