Experimental Thermal Contact Conductance of Electronic Modules-Reference-Cited by-同舟云学术

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Experimental Thermal Contact Conductance of Electronic Modules

Published:1997-04 Issue:2 Volume:11 Page:146-152
ISSN:0887-8722
Container-title:Journal of Thermophysics and Heat Transfer
language:en
Short-container-title:Journal of Thermophysics and Heat Transfer

Author:

Lambert M. A.¹,Cavenall I. G.²,Fletcher L. S.²

Affiliation:

1. San Jose State University, San Jose, California 95192-0087

2. Texas A&M University, College Station, Texas 77843-3123

Publisher

American Institute of Aeronautics and Astronautics (AIAA)

Subject

Condensed Matter Physics,Aerospace Engineering,Space and Planetary Science,Fluid Flow and Transfer Processes,Mechanical Engineering

Link

http://arc.aiaa.org/doi/pdf/10.2514/2.6243

Reference10 articles.

1. Review of the thermal contact conductance of junctions with metalliccoatings and films

2. Experimental investigation of the thermal contact conductance of electroplated silver coatings

Cited by 3 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Role of rectification and hysteresis in controlling thermal contact conductance across joints at low temperatures;Cryogenics;2022-06

2. A Study on Optimized Thermal Analysis Modeling for Thermal Design Verification of a Geostationary Satellite Electronic Equipment;Transactions of the Korean Society of Mechanical Engineers B;2005-04-01

3. Heat transfer — a review of 1997 literature;International Journal of Heat and Mass Transfer;2000-07

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