Author:
Joseph Reji,Asok Kumar N,Sunil Kumar S
Subject
General Physics and Astronomy,General Materials Science
Reference32 articles.
1. Experimental thermal contact conductance of electronic modules;Lambert;J Thermophys Heat Transfer,1997
2. Decrease in thermal contact conductance and the contact pressure of finned- tube heat exchangers assembled with different size bullets;Madhusudana;J Heat Transfer,2007
3. Conductive heat transfer across a bolted automotive joint and influence of interface conditioning;Voller;Int J Heat Mass Transf,2007
4. Thermal resistance in satellite bolted joints;Hakkak,2007
5. Effect of contact pressure and frequency on contact heat transfer between exhaust valve and its seat;Goudarzi;IJE Trans B Appl,2008
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