1. ReleaseIntel Press, “Intel Accelerates Process and Packaging Innovations,” 2021. https://www.intel.com/content/www/us/en/newsroom/news/intel-accelerates-process-packaging-innovations.html.
2. DillingerT., TSMC 2022 Technology Symposium Review—Process Technology Development. Semiwiki.com Blog, 06-22-2022. https://semiwiki.com/semiconductor-manufacturers/tsmc/314415-tsmc-2022-technology-symposium-review-process-technology-development/.
3. ShaikA.I., Samsung plans to manufacture 1.4nm semiconductor chips by 2027, Sammobile.com Blog, 10-04-2022. https://www.sammobile.com/news/samsung-1-4nm-chips-manufacturing-2027-2nm-chips-2025/.
4. Extending the roadmap beyond 3nm through system scaling boosters: A case study on Buried Power Rail and Backside Power Delivery;Rickert;2019 Electron Devices Technology and Manufacturing Conference (EDTM)
5. Buried Power Rails and Back-side Power Grids: Arm® CPU Power Delivery Network Design Beyond 5nm;Prasad;2019 IEEE International Electron Devices Meeting (IEDM),2019