Infrared Light Emission From Semiconductor Devices

Author:

Barton D.L.1,Tangyunyong P.1,Soden J.M.1,Liang A.Y.1,Low F.J.2,Zaplatin A.N.2,Shivanandan K.3,Donohoe G.4

Affiliation:

1. Sandia National Laboratories, Albuquerque, New Mexico

2. Infrared Laboratories, Inc., Tucson, Arizona

3. Institute of Microelectronics National University of Singapore, Republic of Singapore

4. The University of New Mexico, Albuquerque, New Mexico

Abstract

Abstract We present results using near-infrared (NIR) cameras to study emission. characteristics of common defect classes for integrated circuits (ICs). The cameras are based on a liquid nitrogen cooled HgCdTe imaging array with high quantum efficiency and very low read noise. The array was developed for infrared astronomy and has high quantum efficiency in the wavelength range from 0.8 to 2.5 µm. For comparison, the same set of samples used to characterize the performance of the NIR camera were studied using a non-intensified, liquidnitrogen- cooled, slow scan CCD camera (with a spectral range from 400-1100 nm). Our results show that the NIR camera images all of the defect classes studied here with much shorter integration times than the cooled CCD, suggesting that photon emission beyond 1 µm is significantly stronger than at shorter wavelengths.

Publisher

ASM International

Cited by 8 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Computer Vision for Photon Emission Microscopy;2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA);2023-07-24

2. Localization of Hotspots from Lock-in Thermography Images for Failure Analysis;2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC);2021-12-07

3. Detection of DR violations in ASIC components using photon emission techniques;Microelectronics Reliability;2012-09

4. When Failure Analysis Meets Side-Channel Attacks;Cryptographic Hardware and Embedded Systems, CHES 2010;2010

5. Net integrity checking by optical localization techniques;Microelectronics Reliability;2009-09

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