Improved Magnetic Tunnel Junctions Design for the Detection of Superficial Defects by Eddy Currents Testing
Author:
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Electronic, Optical and Magnetic Materials
Link
http://xplorestaging.ieee.org/ielx7/20/6971254/06971594.pdf?arnumber=6971594
Cited by 18 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Progress and comparison in nondestructive detection, imaging and recognition technology for defects of wafers, chips and solder joints;Nondestructive Testing and Evaluation;2023-12-08
2. Neural Networks for Defect Detection on Eddy-Currents-Based Non-Destructive Testing;2023 IEEE SENSORS;2023-10-29
3. Magnetic Imaging of Thimble Tube Using Integrated Array TMR Sensors;2023 IEEE SENSORS;2023-10-29
4. Pulsed Magnetic Flux Leakage Measurement Using Magnetic Head and Tunneling Magnetoresistance for Defect Detection;IEEE Sensors Journal;2023-09-01
5. Review of conventional and advanced non-destructive testing techniques for detection and characterization of small-scale defects;Progress in Materials Science;2023-09
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