Back-Side Residue Analyses and Reduction in FinFET Middle of Line Wafers
Author:
Mitra Reshmi,Konuk Alper
Cited by
2 articles.
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1. A Study on Bevel Metal Film Removal for Bevel Peeling Defect Reduction;2024 Conference of Science and Technology for Integrated Circuits (CSTIC);2024-03-17
2. Pre-Litho Back-Side Etch for Improved Flatness and Yield;2023 34th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC);2023-05-01