A Study on Bevel Metal Film Removal for Bevel Peeling Defect Reduction-Reference-Cited by-同舟云学术

登录注册会员服务联系我们

A Study on Bevel Metal Film Removal for Bevel Peeling Defect Reduction

Published:2024-03-17 Issue: Volume: Page:1-5
ISSN:
Container-title:2024 Conference of Science and Technology for Integrated Circuits (CSTIC)
language:
Short-container-title:

Author:

Liu Xuan¹,Wu Juntao²,Wang Jun¹,Liu Changhuo¹,Ma Yinan³,Cai Yimao⁴

Affiliation:

1. School of software and microelectronics, Peking University Beijing,China

2. Semiconductor Technology Innovation Center (Beijing) Corporation

3. Semiconductor Manufacturing North China (Beijing) Corporation

4. School of Integrated Circuits, Peking University,Beijing,China,100871

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10531806/10531771/10531860.pdf?arnumber=10531860

Reference15 articles.

1. Wafer backside cleaning for defect reduction and litho hot spots mitigation: DI: Defect inspection and reduction

2. Wafer Edge Peeling Defect Mechanism Analysis and Reduction in IMD Process

3. Backside Defect Monitoring Strategy and Improvement in the Advanced Semiconductor Manufacturing

4. Back-Side Residue Analyses and Reduction in FinFET Middle of Line Wafers

5. Bevel etch methods for BEOL peeling defect reduction

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP