Research on the transmission and coupling issue of multilayer TSV and multilayer TSV array-Reference-Cited by-同舟云学术

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Research on the transmission and coupling issue of multilayer TSV and multilayer TSV array

Published:2015-10 Issue: Volume: Page:
ISSN:
Container-title:2015 IEEE 6th International Symposium on Microwave, Antenna, Propagation, and EMC Technologies (MAPE)
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Author:

Ting Kang ,Zhaowen Yan ,Wei Zhang ,Jianwei Wang

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/7504047/7510252/07510408.pdf?arnumber=7510408

Cited by 5 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Research on transmission and crosstalk characteristics of a new type of through silicon via and multilayer through silicon via;Journal of Physics: Conference Series;2024-03-01

2. High performance compact power divider based on TSV;2022 23rd International Conference on Electronic Packaging Technology (ICEPT);2022-08-10

3. Systematic Design Considerations for Test Vehicle of TSV Ground Shielding Array;2022 23rd International Conference on Electronic Packaging Technology (ICEPT);2022-08-10

4. The Research on Small “Dead Zones” Packaging Technology for Mass Production of Silicon Photomultiplier;2022 China Semiconductor Technology International Conference (CSTIC);2022-06-20

5. Characterization of corner/edge effects of through silicon via arrays and layout optimization in 3D integrated circuits;Japanese Journal of Applied Physics;2021-03-25

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