The Research on Small “Dead Zones” Packaging Technology for Mass Production of Silicon Photomultiplier
Author:
Affiliation:
1. College of Nuclear Science and Technology, Beijing Normal University,Beijing,China,100875
Funder
National Key R&D Program of China
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9856647/9856709/09856767.pdf?arnumber=9856767
Reference6 articles.
1. High aspect ratio lithography for lithodefined wire bonding;esfahani;Proceedings - 64th Electronic Components and Technology Conference,0
2. Soft lithography of microfluidics channels using SU-8 mould on glass substrate for low cost fabrication
3. Research on the transmission and coupling issue of multilayer TSV and multilayer TSV array
4. Investigation of TSV noise coupling in 3D-ICs using an experimental validated 3D TSV circuit model including Si substrate effects and TSV capacitance inversion behavior after wafer thinning
5. Performance of a 64-channel, 3.2×3.2cm 2 SiPM tile for TOF-PET application[J];ferri;Nuclear Inst and Methods in Physics Research A,0
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