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Solid-State Relay Solutions for Induction Cooking Applications Based on Advanced Power Semiconductor Devices

  • Published:2019-03 Issue:3 Volume:66 Page:1832-1841
  • ISSN:0278-0046
  • Container-title:IEEE Transactions on Industrial Electronics
  • language:
  • Short-container-title:IEEE Trans. Ind. Electron.

Author:

Fernandez ManuelORCID,Perpina XavierORCID,Rebollo JoseORCID,Vellvehi MiquelORCID,Sanchez David,Cabeza Tomas,Llorente Sergio,Jorda Xavier

Funder

Spanish Ministry of Economy and Competitiveness

Agència de Gestió d'Ajuts Universitaris i de Recerca

BSH Fair Cooking Project

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Control and Systems Engineering

Cited by 17 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Arduino based automatic doorstop control design with LDmicro;AIP Conference Proceedings;2024

2. Next generation induction heating: GAN vs. MOSFET based resonant power converter for residential use;i-manager’s Journal on Electrical Engineering;2024

3. Smart Substation Control and Protection Facilitating the Virtualization of Multiple Protection and Control;2023 IEEE International Conference on Energy Technologies for Future Grids (ETFG);2023-12-03

4. The Power Supply for IH Corresponding to Various Conditions;2023 25th European Conference on Power Electronics and Applications (EPE'23 ECCE Europe);2023-09-04

5. A Novel Induction Heater for Sintering Metal Compacts with a Hybrid Material Extrusion Device;Electronics;2023-07-11
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