Author:
Lonsdale C.J.,Cappallo R.J.,Morales M.F.,Briggs F.H.,Benkevitch L.,Bowman J.D.,Bunton J.D.,Burns S.,Corey B.E.,deSouza L.,Doeleman S.S.,Derome M.,Deshpande A.,Gopala M.R.,Greenhill L.J.,Herne D.E.,Hewitt J.N.,Kamini P.A.,Kasper J.C.,Kincaid B.B.,Kocz J.,Kowald E.,Kratzenberg E.,Kumar D.,Lynch M.J.,Madhavi S.,Matejek M.,Mitchell D.A.,Morgan E.,Oberoi D.,Ord S.,Pathikulangara J.,Prabu T.,Rogers A.,Roshi A.,Salah J.E.,Sault R.J.,Shankar N.U.,Srivani K.S.,Stevens J.,Tingay S.,Vaccarella A.,Waterson M.,Wayth R.B.,Webster R.L.,Whitney A.R.,Williams A.,Williams C.
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering