Interconnect-Based Design Methodologies for Three-Dimensional Integrated Circuits-Reference-Cited by-同舟云学术

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Interconnect-Based Design Methodologies for Three-Dimensional Integrated Circuits

Published:2009-01 Issue:1 Volume:97 Page:123-140
ISSN:0018-9219
Container-title:Proceedings of the IEEE
language:
Short-container-title:Proc. IEEE

Author:

Pavlidis Vasilis F.,Friedman Eby G.

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering

Link

http://xplorestaging.ieee.org/ielx5/5/4796865/04796277.pdf?arnumber=4796277

Cited by 70 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Heterogeneous monolithic 3D integration for hybrid vertical CMOS inverter using n-type IGTO TFT on p-type Si FET;Materials Science in Semiconductor Processing;2025-01

2. Investigation of a Single-Component Additive for Bottom-Up Superfilling of the High-Aspect-Ratio TSV by Theoretical and Experimental Studies;The Journal of Physical Chemistry C;2024-06-15

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4. Genetic Algorithm Based 3D IC Partitioning Approach for TSV Minimization and Efficient Layer Assignment;IETE Journal of Research;2024-01-02

5. Impact of 3-D Integration on Thermal Performance of RISC-V MemPool Multicore SOC;IEEE Transactions on Very Large Scale Integration (VLSI) Systems;2023-12

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