3-D Stacked Package Technology and Trends
Author:
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering
Link
http://xplorestaging.ieee.org/ielx5/5/4796865/04796285.pdf?arnumber=4796285
Cited by 24 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Effect of the addition of Cu6Sn5 nanoparticles on the growth of intermetallic compounds at the interfaces of Sn3.0Ag0.5Cu solder joints;Materials Letters;2024-01
2. Prediction and Analysis of Radiated EMI From a Wafer-Level Package Based on IC Source Modeling;IEEE Transactions on Electromagnetic Compatibility;2023
3. Parallel Multiphysics Simulation of Package Systems Using an Efficient Domain Decomposition Method;Electronics;2021-01-13
4. Warpage simulation method development considering moiré inhomogeneous temperature field;2019 20th International Conference on Electronic Packaging Technology(ICEPT);2019-08
5. Manufacturing of 3D multifunctional microelectronic devices: challenges and opportunities;NPG Asia Materials;2019-06-21
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