Manufacturing of 3D multifunctional microelectronic devices: challenges and opportunities

Abstract

Abstract Sophisticated three-dimensional (3D) forms are expected to be one of the significant development trends in next-generation microelectronics because of their capabilities of rendering substantially enhanced performances, a high degree of integration, and novel functionalities. To date, a diversity of manufacturing methods has been developed for 3D microelectronic devices with different structural and functional features. Most of these methods fall into two categories, i.e., micromanufacturing technologies and mechanically guided 3D assembly approaches. From this perspective, we review the different manufacturing methods and their specific features as well as their limitations. At present, there is still no universal method that can deterministically form 3D microelectronic devices with very high geometric complexity and nanoscale precision. We offer an outlook on future developments in the manufacturing of 3D multifunctional microelectronics devices and provide some perspectives on the remaining challenges as well as possible solutions. Mechanically guided 3D assembly based on compressive buckling is proposed as a versatile platform that can be merged with micromanufacturing technologies and/or other assembly methods to provide access to microelectronic devices with more types of integrated functions and highly increased densities of functional components.