Temperature-Aware Placement for SOCs-Reference-Cited by-同舟云学术

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Temperature-Aware Placement for SOCs

Published:2006-08 Issue:8 Volume:94 Page:1502-1518
ISSN:0018-9219
Container-title:Proceedings of the IEEE
language:
Short-container-title:Proc. IEEE

Author:

Jeng-Liang Tsai ,Chen C.C.-P.,Guoqiang Chen ,Goplen B.,Haifeng Qian ,Yong Zhan ,Sung-Mo Kang ,Wong M.D.F.,Sapatnekar S.S.

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering

Link

http://xplorestaging.ieee.org/ielx5/5/35983/01705139.pdf?arnumber=1705139

Cited by 30 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Channel Material Benchmarking of Si and Ge n- and pMOSFETs Considering Effects of Strain and Operating Temperature;IEEE Transactions on Electron Devices;2023-08

2. Thermal Aware Floorplan Optimization of SoC in Mobile Phone;2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm);2023-05-30

3. ANtarctica: ANalog Thermal Aware, with Reduced Constraint, Technique for Checking & Analysis;2020 IEEE International Integrated Reliability Workshop (IIRW);2020-10

4. Computational Study of Temperature Effects on MOSFET Channel Material Benchmarking;IEEE Electron Device Letters;2020-09

5. Thermal placement on PCB of components including 3D ICs;IEICE Electronics Express;2020

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