System Level Comparison of 3D Integration Technologies for Future Mobile MPSoC Platform-Reference-Cited by-同舟云学术

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System Level Comparison of 3D Integration Technologies for Future Mobile MPSoC Platform

Published:2014-12 Issue:4 Volume:6 Page:85-88
ISSN:1943-0663
Container-title:IEEE Embedded Systems Letters
language:
Short-container-title:IEEE Embedded Syst. Lett.

Author:

Agrawal Prashant,Milojevic Dragomir,Raghavan Praveen,Catthoor Francky,Van der Perre Liesbet,Beyne Eric,Varadarajan Ravi

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

General Computer Science,Control and Systems Engineering

Link

http://xplorestaging.ieee.org/ielx7/4563995/6954216/06911936.pdf?arnumber=6911936

Cited by 6 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

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3. Thermal, Mechanical and Reliability assessment of Hybrid bonded wafers, bonded at 2.5μm pitch;2020 IEEE 70th Electronic Components and Technology Conference (ECTC);2020-06

4. Extreme Wafer Thinning and nano-TSV processing for 3D Heterogeneous Integration;2020 IEEE 70th Electronic Components and Technology Conference (ECTC);2020-06

5. "Hole-in-One TSV", a New Via Last Concept for High Density 3D-SOC Interconnects;2018 IEEE 68th Electronic Components and Technology Conference (ECTC);2018-05

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