Copper lead frame: an ultimate solution to the reliability of BLP package-Reference-Cited by-同舟云学术

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Copper lead frame: an ultimate solution to the reliability of BLP package

Published:2000-01 Issue:1 Volume:23 Page:32-38
ISSN:1521-334X
Container-title:IEEE Transactions on Electronics Packaging Manufacturing
language:en
Short-container-title:IEEE Trans. Electron. Packag. Manufact.

Author:

Kwang-Seong Choi ,Teck-Gyu Kang ,Ik-Seong Park ,Jong-Hyun Lee ,Ki-Bon Cha

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering

Link

http://xplorestaging.ieee.org/ielx5/6104/17958/00827524.pdf?arnumber=827524

Cited by 16 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Development of an ultrasonic-assisted soldering system for Fe-based lead frame surface coating;Journal of Mechanical Science and Technology;2024-03

2. Impact of High Temperature Storage for Prolonged Duration on Cu Leadframe Material Properties for Automotive Applications;2023 IEEE 25th Electronics Packaging Technology Conference (EPTC);2023-12-05

3. Comparison of Mechanical Properties of Nickel-Palladium Plated and Tin-Plated Copper Leadframe Material at Elevated Temperatures;2022 IEEE 24th Electronics Packaging Technology Conference (EPTC);2022-12-07

4. Prediction of coupled 2D and 3D effects in springback of copper alloys after deep drawing;International Journal of Material Forming;2021-06-25

5. Nanoscale corrosion behavior of polycrystalline copper fine wires in dilute NaCl solution investigated by in-situ atomic force microscopy;Corrosion Science;2016-04

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