Prediction of coupled 2D and 3D effects in springback of copper alloys after deep drawing
Author:
Funder
BPIFrance
Publisher
Springer Science and Business Media LLC
Subject
General Materials Science
Link
https://link.springer.com/content/pdf/10.1007/s12289-021-01631-x.pdf
Reference38 articles.
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2. Khoury SL, Burkhard DJ, Galloway DP, Scharr TA (Dec. 1990) A comparison of copper and gold wire bonding on integrated circuit devices. IEEE Trans Compon Hybrids Manuf Technol 13(4):673–681. https://doi.org/10.1109/33.62578
3. Dong Q, Shen L, Cao F, Jia Y, Liao K, Wang M (Apr. 2015) Effect of thermomechanical processing on the microstructure and properties of a cu-Fe-P alloy. J Mater Eng Perform 24(4):1531–1539. https://doi.org/10.1007/s11665-014-1352-6
4. Pham CH, Thuillier S, Manach PY (Apr. 2014) Twisting analysis of ultra-thin metallic sheets. J Mater Process Technol 214(4):844–855. https://doi.org/10.1016/j.jmatprotec.2013.12.006
5. Pham CH, Thuillier S, Manach PY (Dec. 2013) Twisting of sheet metals. AIP Conf. Proc. 1567(1):422–427. https://doi.org/10.1063/1.4850005
Cited by 2 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Numerical simulation of springback and twisting of stamped thin U-shaped copper alloy sheets with a change of the blank alignment;Vietnam Journal of Mechanics;2023-06-30
2. Effect of Lankford Coefficients on Springback Behavior during Deep Drawing of Stainless Steel Cylinders;Materials;2023-06-11
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