Author:
Lau J.H.,Chang C.,Lee S.-W.R.
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Industrial and Manufacturing Engineering
Cited by
20 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Flip Chip Technology;Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology;2024
2. System-in-Package (SiP);Semiconductor Advanced Packaging;2021
3. State of the Art of Lead-Free Solder Joint Reliability;Journal of Electronic Packaging;2020-09-03
4. Failure Analysis of Solder Joints;Assembly and Reliability of Lead-Free Solder Joints;2020
5. Reliability Tests and Data Analyses of Solder Joints;Assembly and Reliability of Lead-Free Solder Joints;2020