1.1 Innovation For the Next Decade of Compute Efficiency
Author:
Affiliation:
1. AMD,Austin,TX
2. AMD,Fort Collins,CO
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10067248/10067251/10067810.pdf?arnumber=10067810
Reference28 articles.
1. A Review of Recent Research on Heat Transfer in Three-Dimensional Integrated Circuits (3-D ICs)
2. 3D V-Cache: the Implementation of a Hybrid-Bonded 64MB Stacked Cache for a 7nm x86-64 CPU
3. DDR5 design challenges
4. Tackling the test challenges of the chiplet revolution;rearick;ITC,2021
5. 2.2 AMD Chiplet Architecture for High-Performance Server and Desktop Products
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