Encapsulation Of Flip Chip Structures-Reference-Cited by-同舟云学术

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Encapsulation Of Flip Chip Structures

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Container-title:Thirteenth IEEE/CHMT International Electronics Manufacturing Technology Symposium
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Author:

Machuga S.C.,Lindsey S.E.,Moore K.D.,Skipor A.F.

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx3/5088/13880/00639861.pdf?arnumber=639861

Cited by 12 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Single-crystal-like Cu joints with high strength and resistance to fatigue failures;Materials Science and Engineering: A;2022-11

2. Dimensional Parameters Controlling Capillary Underfill Flow for Void-Free Encapsulation of a Direct Bonded Heterogeneous Integration (DBHi) Si-bridge Package;2022 IEEE 72nd Electronic Components and Technology Conference (ECTC);2022-05

3. Flip-chip assembly: is the bi-material model acceptable?;Journal of Materials Science: Materials in Electronics;2017-07-15

4. Moisture absorption and hygroscopic swelling behavior of an underfill material;Thermochimica Acta;2012-10

5. Characterization of Encapsulants for High-Voltage High-Temperature Power Electronic Packaging;IEEE Transactions on Components, Packaging and Manufacturing Technology;2012-04

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