Technology trends toward a system-in-a-module in power electronics-Reference-Cited by-同舟云学术

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Technology trends toward a system-in-a-module in power electronics

Published:2002 Issue:4 Volume:2 Page:4-22
ISSN:1531-636X
Container-title:IEEE Circuits and Systems Magazine
language:en
Short-container-title:IEEE Circuits Syst. Mag.

Author:

Lee F.C.,van Wyk J.D.,Boroyevich D.,Guo-Quan Lu ,Zhenxian Liang ,Barbosa P.

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Computer Science Applications

Link

http://xplorestaging.ieee.org/ielx5/7384/26370/01173132.pdf?arnumber=1173132

Cited by 35 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. A Reconfigurable Power System-in-Package Module using GaN HEMTs and IC Bare Dies on LTCC Substrate: Design - Implementation - Experiment and Future Directions;2022 20th IEEE Interregional NEWCAS Conference (NEWCAS);2022-06-19

2. Comparison of sintered silver die attach failure between thermal shock test and mechanical cycling test;Japanese Journal of Applied Physics;2022-05-20

3. A New Structure of Ceramic Substrate to Reduce the Critical Electric Field in High Voltage Power Modules;Journal of Electronic Packaging;2022-03-11

4. Design, Modeling, and Analysis of a 3-D Spiral Inductor With Magnetic Thin-Films for PwrSoC/PwrSiP DC-DC Converters;IEEE Access;2022

5. Degradation Mechanism of Pressure-Assisted Sintered Silver by Thermal Shock Test;Energies;2021-09-04

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