A New Structure of Ceramic Substrate to Reduce the Critical Electric Field in High Voltage Power Modules

Author:

Yan Feifei1,Wang Laili1,Gan Yongmei1,Li Kaixuan1,Zhang Boya1

Affiliation:

1. State Key Laboratory of Electrical Insulation and Power Equipment, Xi'an Jiaotong University, Xi'an 710049, China

Abstract

Abstract The blocking voltage level of silicon carbide (SiC) can reach 10–25 kV, which will significantly increase the power density and capacity of power modules. However, high voltage can induce a high electric field, increase the risk of partial discharge (PD), and threaten the insulation reliability. This paper focuses on the triple points between the metal electrode, silicone gel, and ceramic in power modules. The influencing factors of the electric field at different triple points are fully analyzed. PD experiments are performed and the results show that the interface between silicone gel and ceramic is a weak area of insulation. Therefore, this paper demonstrates that area of weak insulation and high electric field meet at the triple point. To solve this problem, a new structure of the ceramic substrate is proposed, which isolates the interface area from the high electric field. At the same time, the new structure can significantly reduce the high electric field reinforcement.

Funder

National Natural Science Foundation of China

Publisher

ASME International

Subject

Electrical and Electronic Engineering,Computer Science Applications,Mechanics of Materials,Electronic, Optical and Magnetic Materials

Reference30 articles.

1. Review of Thermal Packaging Technologies for Automotive Power Electronics for Traction Purposes;ASME J. Electron. Packag.

2. Application of Wide Bandgap Devices in Renewable Energy Systems - Benefits and Challenges;ICRERA,2014

3. SiC Device and Power Module Technologies for Environmentally Friendly Vehicles,2012

4. 10-kV SiC MOSFET Power Module With Reduced Common-Mode Noise and Electric Field;IEEE Trans. Power Electron.,2020

5. Technology Trends Toward a System-in-a-Module in Power Electronics;IEEE Circuits Syst. Mag.,2002

Cited by 2 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Dielectric Properties Characterization and Evaluation of Commercial Silicone Gels for High-Voltage High-Power Power Electronics Module Packaging;IEEE Transactions on Dielectrics and Electrical Insulation;2023-02

2. Comparative Analysis on Insulation Degradation Characteristics of Two Commercial Silicone Gels;2022 IEEE International Conference on High Voltage Engineering and Applications (ICHVE);2022-09-25

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号  京ICP备18003416号-3