A Composite Structure of Low Dielectric Substrate for 5G mmWave and the Application in Flexible Printed Circuit (FPC)
-
Published:2019-10
Issue:
Volume:
Page:
-
ISSN:
-
Container-title:2019 14th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)
-
language:
-
Short-container-title:
Author:
Lee Wei-Chih,Du Bo-Sian
Cited by
3 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献