Broadband measurement of insertion loss of FCCL directly metallized on modified Polyimide
Author:
Affiliation:
1. Seoul National University of Science and Technology (SeoulTech),Seoul,South Korea,01811
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10388486/10388434/10388765.pdf?arnumber=10388765
Reference6 articles.
1. Flexible printed circuit board based on graphene/polyimide composites with excellent thermal conductivity and sandwich structure
2. Broadband insertion loss measurement of flexible copper clad laminate with direct metallization
3. A Composite Structure of Low Dielectric Substrate for 5G mmWave and the Application in Flexible Printed Circuit (FPC)
4. An inline microstrip-to-waveguide transition operating in the full W-Band based on a Chebyshev multisection transformer
5. Multiline TRL revealed
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