Wafer Defect Pattern Recognition and Analysis Based on Convolutional Neural Network-Reference-Cited by-同舟云学术

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Wafer Defect Pattern Recognition and Analysis Based on Convolutional Neural Network

Published:2019-11 Issue:4 Volume:32 Page:566-573
ISSN:0894-6507
Container-title:IEEE Transactions on Semiconductor Manufacturing
language:
Short-container-title:IEEE Trans. Semicond. Manufact.

Author:

Yu Naigong^ORCID,Xu Qiao^ORCID,Wang Honglu

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://xplorestaging.ieee.org/ielx7/66/8890013/08815875.pdf?arnumber=8815875

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3. Efficient Dual-Attention-Based Knowledge Distillation Network for Unsupervised Wafer Map Anomaly Detection;IEEE Transactions on Semiconductor Manufacturing;2024-08

4. Correlation analysis of sampled wafer profile maps based on a deep reconstruction model;Applied Soft Computing;2024-07

5. Detecting Low-Yield Machines in Batch Production Systems Based on Observed Defective Pieces;IEEE Transactions on Systems, Man, and Cybernetics: Systems;2024-07

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