Author:
Kandalaft Nabeeh,Rashidzadeh Rashid,Ahmadi Majid
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Computer Graphics and Computer-Aided Design,Software
Cited by
6 articles.
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1. Kelvin Bridge Structure Based TSV Test for Weak Faults;2021 IEEE International Test Conference in Asia (ITC-Asia);2021-08-18
2. TSV Prebond Test Method Based on Switched Capacitors;IEEE Transactions on Very Large Scale Integration (VLSI) Systems;2019-01
3. The Mathematical Model and Novel Final Test System for Wafer-Level Packaging;IEEE Transactions on Industrial Informatics;2017-08
4. TSV Extracted Equivalent Circuit Model and an On-Chip Test Solution;IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems;2016-04
5. Trends in 3D Integrated Circuit (3D-IC) Testing Technology;Three-Dimensional Integration of Semiconductors;2015