Characterization and integration of porous extra low-k (XLK) dielectrics-Reference-Cited by-同舟云学术

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Characterization and integration of porous extra low-k (XLK) dielectrics

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Container-title:Proceedings of the IEEE 2000 International Interconnect Technology Conference (Cat. No.00EX407)
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Author:

Changming Jin ,Wetzel J.

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx5/6889/18548/00854294.pdf?arnumber=854294

Cited by 24 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

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4. Electrical Stability and Reliability of Ultralow Dielectric Constant Porous Carbon-Doped Oxide film for Copper Interconnect;Journal of The Electrochemical Society;2005

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