The Impact of Size Effects and Copper Interconnect Process Variations on the Maximum Critical Path Delay of Single and Multi-Core Microprocessors-Reference-Cited by-同舟云学术

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The Impact of Size Effects and Copper Interconnect Process Variations on the Maximum Critical Path Delay of Single and Multi-Core Microprocessors

Published:2007 Issue: Volume: Page:
ISSN:
Container-title:2007 IEEE International Interconnect Technology Conferencee
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Author:

Lopez Gerald,Murali Raghunath,Sarvari Reza,Bowman Keith,Davis Jeffrey,Meindl James

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx5/4263633/4263634/04263658.pdf?arnumber=4263658

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